TOWA USA CORPORATION

Quarter-Lead IC Packaging

Located in Silicon Valley, TOWA USA accelerates semiconductor innovation. Our San Jose Application Lab offers complete product development and expert process engineering, backed by advanced molding systems.

Maintaining a Quarter-Lead

Our mission: contribute to industrial growth by providing key enabling technologies for each product generation. We maintain a 'quarter-lead' over competition, ensuring our innovative products meet market demand first.

Core Packaging Capabilities

From initial design to high-yield production, TOWA USA provides the equipment and expertise to scale your operations.

High-Precision Molding

San Jose Application Lab

Genuine Spare Parts

Rapid identification and supply of precision spare parts, ensuring minimal downtime and continuous high-throughput operation.

Advanced compression and transfer molding systems engineered for high-density IC encapsulation and optimal yield.

Validate packaging concepts on production-grade systems. Our lab offers full product development and process engineering support.